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100g Japan KINGBO RMA -218 no-clean BGA reballing soldering flux solder paste

100g Japan KINGBO RMA -218 no-clean BGA reballing soldering flux solder paste

item ID: 47632
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100G Japan KINGBO RMA -218 No-Clean BGA reballing repair solder soldering flux solder paste

 

100G Japan KINGBO RMA -218 No-Clean BGA Reballing Repair Solder Soldering Flux Paste
Features:
KINGBO RMA-218 No-Clean Solder paste(100g)
The KINGBO RMA-218 is a high viscosity no-clean flux that can be used for rework, sphere or pin attachment to BGA, CGA and CSP packages, and assembly operations such as Flip Chip attachment to PWB substrates.
It is original , Made in Japan
Good formula for BGA reballing / balls worksit can stick the balls much more

Package inside:
1 x kingbo flux

Thanks for your order!

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