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250K leaded Qwin solder ball 0.2,0.25,0.3,0.35,0.4,0.45,0.5,0.55,0.6,0.65,0.76mm for reballing of most common used BGA chip repair

250K leaded Qwin solder ball 0.2,0.25,0.3,0.35,0.4,0.45,0.5,0.55,0.6,0.65,0.76mm for reballing of most common used BGA chip repair

item ID: 47922
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250K leaded Qwin solder ball 0.2,0.25,0.3,0.35,0.4,0.45,0.5,0.55,0.6,0.65,0.76mm for reballing of most common used BGA chip repair

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