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LY IR-777 Mini 2 In 1 Intelligent Thermal Infrared Imager Analyzer BGA Rework Station Built-in Laser Heating De-soldering Function Max 30*30MM Work Area For Mobiles Repair Power 160W

LY IR-777 Mini 2 In 1 Intelligent Thermal Infrared Imager Analyzer BGA Rework Station Built-in Laser Heating De-soldering Function Max 30*30MM Work Area For Mobiles Repair Power 160W

item ID: 65243
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LY IR-777 Mini 2 In 1 Intelligent Thermal Infrared Imager Analyzer BGA Rework Station Built-in Laser Heating De-soldering Function Max 30*30MM Work Area For Mobiles Repair Power 160W

Specification:

Brand: LY

Model: IR-777/IR777

Product: 2 In 1 Thermal Infrared Imager Analyzer With Laser De-soldering BGA Rework Machine

Voltage: 220V-110V Common Use

IR power: 100W

Laser Power: 55W

LED: 5W

Temperature Control Range: 100-450 degree (Adjustable)

Heat Type: Laser

Built-in Touch Screen Size: 7 Inch

HDMI CCD Monitor Size: 10 inch

CCD Camera Resolution: 48000K Pixels 4K

CCD ZOOM: X20-270X

Frame Number: 60/S

Power: DC-12V

Net Weight: 6.2KG

Gross Weight: 8.4KG

Product Size: 290*290*340MM

Package Size: 425*355*325MM

 

Q:What’s Compare with traditional hot air de-soldering?

A:

1.More quicker, high Efficiency

2.Visable

3.Release your hand which hold hot air gun.

 

 

Q:What’s Thermal Infrared Imager Analyzer?

A:The infrared thermal imager uses optical imaging lens and infrared detector to receive the infrared radiation energy of the measured target, converts the infrared radiation energy into standard video signal, and displays the infrared thermal image through the display screen. This thermal image corresponds to the thermal distribution field of the object surface and is the thermal image distribution of the infrared radiation of each part of the measured target object. The infrared thermal imager can accurately quantify the detected heat and accurately identify and strictly analyze the heating fault area. Therefore, the infrared thermal imager can measure the temperature accurately without contact and display the distribution of thermal field in real time, making it the best tool for nondestructive flaw detection such as circuit board detection.

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