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HT-R490 BGA Rework Hot Air Soldering Machine 110V US Warehouse Stock, 3 Zones Chip Desoldering Station for Xbox PlayStation Laptop Motherboard Repair
item ID: 83684
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Technical Parameters
| Basic Parameters | |
| Heating | HR |
| Dimension | L580mmx W560mmx H650mm |
| Weight | 28kg |
| Total weight | About 35 kg, vary with the differen need of the users |
| Electrical Parameters | |
| Power | 220V AC |
| Upper Heating | HR |
| Size of upper (IR) | ————— |
| Consumption of upper (IR) | ————— |
| Nozzle of upper(HR) | 4pcs: 19×19, 29×29,34×34,37×37 mm |
| Consumption of upper (HR) | 800W |
| Bottom Heating | HR |
| Nozzle of bottom(HR) | 1 pcs: 50×50 mm |
| Consumption of bottom (HR) | 800W |
| Bottom Preheat | IR |
| Consumption of preheat (IR) | 2400W |
| General power | 4KW |
| Temperature Control | |
| Control mode of Upper | Independent temperature control, high-precision closed-loop control, precision ± 0.5%, Alarm |
| Control mode of Bottom | Independent temperature control, high-precision closed-loop control, precision ± 0.5%, NO Alarm |
| Rework Function | |
| SMD | Suit for welding, remove or repair packaged devices such as BGA,PBGA,CSP,multi-layer substrates, EMI metallic shield product and solder/lead free Rework welding |
| Size of applicable chips | ≤80mm x80 mm |
| Size of applicable PCB | MIN 10mm*10mm MAX 350mm*400mm |
Packing list:
1× bga rework station
5× nozzles: 4 pcs top(19,29,34,37mm) and 1 pcs bottom(50mm);
6× pcb jig (with screw)
1x vacuum pen
1× k-type thermocouple
1x socket head wrench
1x Computer Cable
1× CD of manual and software (if not get, may be lost in customs, please contact us)
Thanks for your order!
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