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Zhuomao ZM-R5860 ZM-R5860C BGA REWORK STATION 3 ZONES

Zhuomao ZM-R5860 ZM-R5860C BGA REWORK STATION 3 ZONES

item ID: 65365
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Zhuomao ZM-R5860 ZM-R5860C BGA REWORK STATION 3 ZONES

Product
specification:

 

1- Adopt
liner slide which makes X- Y- Z
axis all can do precision adjustment or fast positioning, with high
positioning accuracy and fast maneuverability;

 

2- high
definition touch screen (Taiwan) , PCL control, can save multiple
groups profile, password protection and modify function, and can save
multiple groups profile, equipped with instant temperature curve
analysis function; 

 

3- There
are 3 independent heating areas from top to bottom. The 1st and 2nd
are hot-air heaters, the 3rd is IR preheating, temperature controlled
within ±3 °; Top heater can be adjusted freely, second heater can
be adjusted up and down, top and bottom temperature can control many
groups and sections of temperature parameters at the same time; the
third IR heater can be adjusted the power consumption; 4- Offer
all kinds of hot-air nozzle, it can rotate 360°;With
magnet, easy to install and change, customized is available; Bottom
IR heater ensure an even heat for PCB board; 

 

5 – Choose
imported high-precision K-type thermocouple, closed loop control and
automatic temperature compensation system, combined PLC module for
the precision control of temperature. 

 

6. Use a
V-groove equipped with a flexible fixture for PCB positioning to
protect the PCB from deformation when heated or cooled, and it can
rework for any BGA package size; 

 

7- powerful
cross-flow fan rapidly cool the PCB board to improve efficiency; Also
built-in vacuum pump and external vacuum suction pen, pick up the
chips rapidly; 

 

8.After
finishing desoldering & soldering, There is an alarming and
alarming in advance; 

 

9- CE
certificate, with emergency stop and Automatic power-off protection
device when abnormal accident happens;with
a double over-heating protection control;

 

10- CCD
vision system, accurate judgments on the melting process during the
BGA soldering and desoldering, provide critical vision.

 

specifications
and technical parameters

1 Total Power 4800W
     
2 Top heater 800W
     
3 Bottom heater 2nd heater 1200W,3rd
    IR heater 2700W
     
4 Power supply AC220V±10%
    50/60Hz
     
5 dimension 635×600×560mm
     
6 Positioning V-groove, PCB support can be
    adjusted in any direction with external universal fixture
     
7 Temperature control (K Sensor) closed loop,
    independent heating, precision within ±3°c.
     
8 PCB size Max 410×370mm Min 20×20 mm
     
9 Electrical selection Highly sensitive temperature
    control module+Touch
    screen (Taiwan)+Delta PLC
     
10 Net Net Weight 50kg

 

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