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LY-G850 semi-automatic 3 zones max 50x45cm big area hot air Align BGA rework station 220V 6800W

LY-G850 semi-automatic 3 zones max 50x45cm big area hot air Align BGA rework station 220V 6800W

item ID: 59305
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LY-G850 semi-automatic 3 zones max 50x45cm big area hot air Align BGA rework station 220V 6800W

 

  • Touch screen with human interface,heating time,heating temperature,reflow temperature rate,advanced alarming,vacuum time all can set inside the touch screen,simple operation,easy learn.
  • PLC import from Japan,temperature control module use China famous brand,display three temperature curves,4pcs independent temperature sensor,which can measure the different place temperature of the chips,make sure the rework rate.
  • Three independent heating temperature zone,each heating temperature zone can independently set the heating temperature ,heating time,rate;six heating temperature sections,Simulate the reflow oven heating mode[preheating,constant,warming,soldering,reflow soldering,cooling.
  • Auto feed chips,pick up chips,blowing chips;auto recognition chips place during alignment Multifunction model weld,remove,mount,manual,realize semi auto and auto function ,meet customer’s requirement
  • High precision K-type Closed Loop import from USA together with our company special heating way,the soldering rang of temperature within±1 degree
  • Imported optical alignment system with 15’’high definition monitor;high precision micrometer adjust X/Y/R axis;make sure the alignment precision within 0.01-0.02mm.
  • Top heater and mounting heater design 2 in 1 which can make the mounting more precision;there are many sizes of BGA nozzles which can meet different chips sizes,BGA nozzles can easy change,we accept customize.
  • High automatic and precision,Completely avoid human operation error; it is good for reworking lead free craft and double BGA,QFN,QFP,capacitance-type resistor components which can achieve good result.
  • Additional monitoring camera which can observe the solder ball melting and easy to check the temperature curve and the soldering result(optional function )

 

 

 

 

 

Technology Parameter of LY-G850 BGA Rework Machine

 

Power 6800W
Up heater power 1200W
Down heater power 1200W
IR heater power 4200W(2400W control)
Power supply (Single Phase)  AC 220V±10 50Hz
Position way Optical lens+ Vshape holder+laser positioning
Temperature control High precision K shape sensor(Closed Loop),up and down independent temperature heating zone,Precision can reach±1℃
Material High sensitive touch screen+temperature control module+PLC+step drive
PCB Size Max:500×450mm , Min: 10×10mm
Thermo-couple Ports 4pcs
Chips magnification times 2-30
PCB thickness 0.5-8mm
BGA size 0.8mm-8cm
Min.chips pitch 0.15mm
Mounting BGA weight 1000G
Mounting precision ±0.01mm
Overall dimension L670×W780×H850mm
Optical alignment lens Motor drive can move front back right left
Weight of machine About 90kg

 

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